Hardware Components Evolution Towards 6G
Tuesday, 3 June 2025, 9:00 – 12:30, room 1.1
Organisers:
- Alexios Birbas (Univ. Patras, )
- Luís Pessoa (Univ. Porto/INESC TEC, PT)
- Ioannis Tomkos (Univ. Patras, )
- Bernard Barani (6G-IA, )
Motivation and Background
The evolution of hardware components for 6G introduces challenges that are distinct from those faced in previous mobile network generations. Unlike 5G, which could leverage established and widely available semiconductor technologies, the path to 6G is more complex. The semiconductor industry currently struggles to meet the stringent requirements of millimeter-wave (FR2) and sub-terahertz frontends—both of which are crucial to enabling 6G performance.
Recognizing the strategic importance of microelectronics in this context, Europe has launched initiatives such as the EU Chips Act and its associated pilot lines. These policies aim to strengthen industrial capacity and promote synergies between the microelectronics and telecommunications sectors—key to securing Europe’s technological autonomy.
The workshop will focus on several critical areas:
- Next-generation microelectronics and photonic components targeting RF, mmWave, THz, and optical frequencies
- Innovative circuit and system design techniques tailored for 6G telecommunications hardware
- Processing and acceleration requirements, including virtualization and embedded intelligence
- Advanced heterogeneous packaging involving the integration of multiple chiplets in compact, efficient architectures
- Progress in semiconductor technologies such as CMOS, GaAs, SiGe, and InP, across diverse frequency bands
- Scalable MIMO and beamforming techniques to enable wide bandwidth and high-capacity transmission
- Emerging platforms for non-CMOS computing, including machine learning accelerators embedded at the edge
In the medium term, the so-called flexible FR3 band (6–24 GHz) offers a compelling opportunity for early 6G deployment. This spectrum window supports both the adaptation of existing hardware platforms and the development of new radio components using mature and scalable semiconductor technologies.
This workshop will serve as a forum to discuss the technological challenges and breakthroughs required for 6G hardware. It will spotlight Europe’s strategic positioning in microelectronics and aim to foster cross-sector collaboration. By addressing these key areas, the session will contribute to reinforcing Europe’s leadership and sovereignty in next-generation wireless systems.
Structure
09:00 – 09:20: Opening: Microelectronics in the 6G-SNS
Chair-person: Prof. Ioannis Tomkos, University of Patras (HT-WG Founding Chair) .
Microelectronics, a key component of a competitive European Telecom ecosystem, Bernard Barani (6G-IA)
09:20 – 10:30: Session 1: Technology Platforms for 6G Components
Chairperson: Prof. V. Paliouras, University of Patras
- IC technologies for mmWave and sub-THz communications, Didier Belot, ST Microelectronics (X-TREME 6G)
- RF-SOI CMOS hybrid integration with low-cost PCB technology for sub-THz RIS-based Transceivers, Luis Pessoa, INESC TEC (TERRAMETA)
- Photonics and integration for 6G: iMWP Photonics platforms developing components for 6G, Chris Roeloffzen, LioniX International (PROTEUS-6G)
- Dielectric Waveguide Antennas enabling Millimeter-wave/Phase Arrays for 6G Wireless Communications, Luis Gonzalez-Guerrero, UC3M (TERA6G)
- Component challenges for 6G expansion: Microelectronics components requirements for the FR3 Band – A Telecom Equipment Manufacturer perspective, Mohand Achouche, Nokia-F (X-TREME 6G)
- Acceleration requirements for virtualized platforms (BEGREEN)
Coffee break
11:00 – 12:00: Session 2: Enabling Component Technologies for 6G
Chairperson: Prof. Luís Pessoa (HT-WG Vice-Chair)
- Design for sub-THz bands: role of each sub-component in power consumption and antenna integration challenges, Mamoun Guenach, IMEC (Hexa-X-II)
- Efficient RF and mmWave circuits for 6G, Ahmet Cagri Ulusoy, KIT (X-TREME 6G)
- 300 GHz measurements: Active devices measurements and experimental validation of Reflective Intelligent Surfaces in a THz link, Frédéric Dutin, Guillaume Ducournau et al., University of Lille/CNRS (6G-TIMES)
- Next generation Reconfigurable and energy efficient RF systems with focus on 22nm FDSOI Front-end IC development, Padmanava Sen, Barkhausen Institute (INSTINCT/6G-SENSES)
- Heterogeneous and 3D packaging technologies for 6G, Dionysios Manessis, Fraunhofer IZM (X-TREME 6G)
12:00 – 12:30: Key questions that will be discussed include the new constraints brought by 6G on microelectronics capabilities, SNS priorities for microelectronics in the upcoming Work Programmes and the importance of the Chips JU pilot lines for the SNS microelectronics developments.
Moderator: Bernard Barani (6G-IA)
Panelists:
- Padmanava Sen, Barkhausen Institute (INSTINCT/6G-SENSES)
- Dionysios Manessis, Fraunhofer IZM (X-TREME 6G)
- Mohand Achouche, Nokia-F (X-TREME 6G)
- Chris Roeloffzen, LioniX International (PROTEUS-6G)
