Panel 32022-06-13T20:00:54+00:00

Developments and Challenges Enabling 6G THz Radio HW

Friday, 10 June 2022, 11:00-12:30, Auditorium WTC

Organizer

  • Aarno Pärssinen (Univ. of Oulu, FI)

Motivation and Background

Upper mmW region from 100GHz up to THz range is getting a lot of interest in 6G radio research for communications and sensing. However, physical boundaries in technologies from semiconductors to packaging will force us to rethink how we implement radios capable of extremely high sensing and imaging precision and data rates up to and beyond 100Gbps in communications. Feasibility of enabling technologies needs to be considered and confirmed before standardization taking cost and power consumption into account.
Silicon-based semiconductor technologies have been dominating and facilitating the industry for more than 30 years miniaturizing radio frequency (RF) hardware and improving digital processing capabilities such that their enablement to reduce size, power consumption and add flexibility have been considered self-evident. Already lower mmW bands and data rates that 5G can support have shown the first signs that future might not be as straightforward as one would wish. Early research is already showing that in 6G challenges will not get any easier, vice versa.
This panel with top experts from industry and academia will discuss the challenges and opportunities to achieve the goals, and highlight issues that communication industry should consider and foster in advance to facilitate standardization. It is evident that hardware and physics-based boundaries require more attention than in previous cellular generations. Co-design from systems and algorithms to radio RF and computing hardware are core elements for success.

Questions

  1. What are the biggest disruptions and challenges in technologies as we are moving towards THz region and what use cases they will potentially enable?
  2. What are the key new enabling technologies that we need compared to generations up to 5G when moving up in data rates and thus carrier frequencies?
  3. Does it make sense to combine radio communications, localization, sensing, imaging and spectroscopy and which of them? Or should they be seen as stand-alone functions in future devices?
  4. Do you see any role or opportunities in machine learning or artificial intelligence that would facilitate RF/digital hardware design and not just require more computational resources?
  5. What are the key items from your perspective requiring early-phase co-design between HW and communications/sensing systems?

 Participants

The panel is composed of (see CVs below):

  • Chair: Aarno Pärssinen (Moderator) (Univ. of Oulu, FI)
  • Jaehoon Chung (LG Electronics, KR)
  • Volker Ziegler (Nokia, DE)
  • Liesbet Van der Perre (KU Leuven, BE)
  • Pascal Chevalier (STMicroelectronics, FR )
  • Michael Peeters (IMEC, BE)

Aarno Pärssinen

Aarno Pärssinen received the Doctor of Science degree in electrical engineering from the Helsinki University of Technology, Finland, in 2000. In 1996, he was a Research Visitor at the University of California at Santa Barbara. From 2000 to 2011 he was with Nokia Research Center, Helsinki, Finland where he served as a member of Nokia CEO Technology Council from 2009 to 2011. From 2011 to 2013, he was at Renesas Mobile Corporation, Helsinki, Finland and then joined Broadcom, Helsinki, Finland as part of business acquisition until September 2014. Since September 2014 he has been with University of Oulu, Centre for Wireless Communications, Finland where he is currently a Professor. He leads Devices and Circuits research area in 6G flagship program financed by Academy of Finland.
His research interests include wireless systems and transceiver architectures for wireless communications with special emphasis on the RF and analog integrated circuit and system design. He has authored and co-authored one book, two book chapters, more than 150 international journal and conference papers and holds several patents. He is also one of the original contributors to Bluetooth low energy extension, now called as BT LE. He served as a member of the technical program committee of Int. Solid-State Circuits Conference in 2007-2017, chairing the wireless subcommittee in 2014-2017.

Jaehoon Chung

Jaehoon Chung is a Research Fellow at LG Electronics, Inc., where he is taking a technical director role for the advanced R&D projects/tasks. He received a B.S. from Yonsei University in 1997, and M.S.E.E. and Ph.D. degrees from Korea Advanced Institute of Science and Technology (KAIST) in 1999 and 2005, respectively. After joining LG Electronics in 2006, he has worked on 3GPP standardization by 2011 focusing on LTE & LTE-Advanced physical layer technologies. Since 2012, he has been mainly leading technology R&D and technical vision/strategy development of company and government for 5G wireless communication. Also he has been working for physical layer design on 3GPP 5G NR standardization from 2015 to 2019. He is currently leading advanced technology R&D activities for 6G wireless communication in LG Electronics.
His research interests include terahertz radio communication, full duplex radio, mmWave, massive MIMO, LDPC/Polar code, NoMA, AI/ML aided air interface, and so on. He received the National Order of Scientific & Technical Merit – President & Minister Citation from Korea government in 2012 and 2020, respectively. He has currently the vice chairman position on Ecosystem Strategy committees in 5G Forum Korea, and holds more than 700 patents.

Presentation available!

Volker Ziegler

Volker is an energetic leader with 25+ years of broad and international experience in thetelecommunications industry. He currently serves as Senior Technology Advisor and Chief Architect in Nokia Strategy and Technology unit. Previously, Volker has exercised a leadership role with Nokia Bell Labs in 6G research and ecosystem and has served as Head of 5G Leadership and Chief Architect of Nokia Mobile Networks. Prior to this, Volker has been active in the Head of Strategy role of Nokia Siemens Networks where he had also served as the Head of the North East Region. In his 10+ year career with Siemens, Volker has held business unit leadership, finance, sales and marketing, services and R&D global roles and senior positions. He has worked as Information Technology Specialist with the World Bank / IFC in the mid-90s. Volker has started his career as a research scientist with German Aerospace Research / DLR. Volker holds a Dr.-Ing. (PhD) degree in Electrical Engineering from Technische Hochschule (TH) Karlsruhe in Germany and is a graduate of the Executive Development Program at Harvard Business School.

Presentation available!

Liesbet Van der Perre

Liesbet Van der Perre is Professor at the department of Electrical Engineering at the KU Leuven in Belgium and guest Professor at the University of Lund in Sweden. She received her Ph.D. degree from the KU Leuven in 1997. Dr. Van der Perre was with the nano-electronics research institute imec in Belgium from 1997 till 2015 where she took up responsibilities from system architect to director of the wireless program. She was appointed honorary doctor at Lund University, Sweden, in 2015. Prof. L. Van der Perre’s main research interests are in wireless communication and embedded connected systems, with a focus on energy efficient solutions for IoT and (beyond) 5G systems. She has (co-)authored over 350 scientific papers and 4 books. Liesbet Van der Perre has been serving as a scientific and technological advisor for companies, institutes, and funding agencies.

Presentation available!

Pascal Chevalier

Pascal Chevalier received the Ph.D. degree in electronics from the University of Lille, France, in 1998 for his work on InP-based HEMT. He joined Alcatel Microelectronics, Belgium, in 1999, where he contributed to the start of RF BiCMOS. Since joining STMicroelectronics, Crolles, France, in 2002, he has been working on the development of SiGe BiCMOS and RF-SOI CMOS technologies and led research activities on Analog and RF silicon-based devices such as SiGe HBT’s, RF switches and Si LDMOS transistors for bulk and SOI CMOS derivatives technologies. He is currently leading the RF-SOI CMOS, BiCMOS & Disruptive Technologies R&D team and is a Senior Member of Technical Staff. Dr. Chevalier has authored or co-authored over 200 technical journal papers and conference publications and has filed about 25 patents. He has served the Technical Program Committees of the IEEE Bipolar / BiCMOS Circuits and Technology Meeting (BCTM) and the ECS SiGe Symposium. He has been a member of the RF & AMS Technologies section of the ITRS of which he led the Silicon Bipolar & BiCMOS subgroup. He currently serves the Technical Program Committees of the IEEE Bipolar and Compound Semiconductor Integrated Circuits and Technology (BCICTS) and the IEEE International Electron Devices Meeting (IEDM).

Michael Peeters

Michael Peeters is VP of R&D for Connectivity at imec. His previous experience as CTO for both the Wireline and Wireless business lines at (what is now) Nokia was built on the culture, enthusiasm, and love for technology and science that he got from his time at Bell Labs—and the principles of Free Inquiry bestowed on him by his Alma Mater, the Vrije Universiteit Brussel (VUB). Next to this, he has served as the President of the CBRS Alliance, on the Board of 5G Americas, and on the Board of ATIS. Passionate about inspiring the next generation of engineers with the challenges of communications, he currently also lectures in Advanced Wireless and 5G Networks at the University of Antwerp. During his research career starting with a Ph.D. in Applied Physics and Photonics from the Vrije Universiteit Brussel (VUB), he has authored more than 100 peer-reviewed publications, many white papers and holds patents in the access and photonics domains. An electrotechnical engineer by training, he is a senior member of IEEE and a Fellow of the VUB. Outside of work, his quest to discover the recipe for a perfect lasagna is balanced by bouts of long-distance running to offset the inherent caloric intake. See also: https://www.linkedin.com/in/multiplex/

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